Viscoelastic model to capture residual stresses in heat cured dissimilar adhesive bonded joints

نویسندگان

چکیده

The thermal loading during the curing process of an adhesive-bonded joint induces residual stresses in joint, thereby affecting its performance. problem becomes worse case a multi-material involving varying coefficients expansion (CTE) for different parts. A novel approach was developed to model properties automotive grade structural adhesives heat process. material divided into two components: kinetics and viscoelastic mechanical model. models were calibrated using experimental data from Differential Scanning Calorimetry (DSC) Dynamic Mechanical Analysis (DMA) tests performed on epoxy-based single-component adhesive. parameters fed finite element simulation prediction results compared unique set experiments utilizing substrate combinations single lap shear joints. An excellent agreement between simulated (displacement across bond, force applied by adhesive) achieved. modeling give better understanding agree with trend effect bondline thickness joint.

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ژورنال

عنوان ژورنال: International Journal of Adhesion and Adhesives

سال: 2021

ISSN: ['1879-0127', '0143-7496']

DOI: https://doi.org/10.1016/j.ijadhadh.2021.102844